C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
117/198, 400/511
C09D 163/02 (2006.01)
Patent
CA 1092275
ABSTRACT A thermosetting resin composition consisting essentially of a solid epoxy resin having a molecular weight in the range 1,000-4,000, 1-15% by weight of the epoxy resin of a curing agent therefor and 0.5 to 3.0% by weight of the composition of a flow control agent consisting essentially of liquid poly(ethyl acrylate) having a number average molecular weight in the range 5,000 to 15,000. The composition when melt compounded and milled to an average particle size diameter of 2-20 microns can be electro- statically deposited onto metallic surfaces such as can interiors to produce an ultra thin(0.3-1.0 mil thick) protective coating on curing.
256521
Billmyer Jerrold B.
Larsen Donald W.
Gowling Lafleur Henderson Llp
W. R. Grace Co.
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