Flow field plates and a method for forming a seal between them

H - Electricity – 01 – M

Patent

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Details

H01M 8/02 (2006.01) C25B 9/00 (2006.01) C25B 9/04 (2006.01) H01M 8/24 (2006.01)

Patent

CA 2445282

A flow field plate having a plurality of protrusions formed integrally on at least on surface, said protrusions being adapted in use to join the flow field plate to an adjacent flow field plate. The material of the plate may be an electrically conductive polymer, which may comprise a conductive filler and carbon nanofibres. The plates may be welded together by ultrasonic welding.

Plaque de champ d'écoulement possédant plusieurs saillies formées intégrales sur au moins une surface, lesdites saillies étant conçues pour joindre, lors de l'utilisation, la plaque d'écoulement de champ à une plaque d'écoulement de champ adjacente. Le matériau utilisé pour les plaques peut être un matériau polymère conducteur d'électricité, qui peut comprendre une charge conductrice et des nano-fibres de carbone. Les plaques peuvent être soudées entre elles par soudage ultrasonique.

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