Fluid cooled semiconductor device

Details Fluid cooled semiconductor device Fluid cooled semiconductor device

H - Electricity

01

L

347/36, 356/95

H01L 23/46 (2006.01)

Patent

CA 1131793

RD-11272 FLUID COOLED SEMICONDUCTOR DEVICE Abstract of the Disclosure A semiconductor electronic device operates at high power levels using structured copper to reduce generation of stress between the elements of the device during thermal cycling in the course of normal operation. Structured copper strain buffers are used to attach each side of a silicon wafer to fluid cooled heat sinks to provide efficient removal of heat generated by the device and good electrical connection to the silicon wafer.

338567

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