H - Electricity – 01 – M
Patent
H - Electricity
01
M
H01M 8/02 (2006.01) C01B 6/00 (2006.01) F17C 1/00 (2006.01)
Patent
CA 2655580
Embodiments of the invention relate to a fluid enclosure including a structural filler and an outer enclosure wall conformably coupled to the structural filler. Embodiments of the present invention further relate to a method of manufacturing a fluid enclosure. The method includes conformably coupling an outer enclosure wall to a structural filler.
La présente invention concerne entre autres modes de réalisation, un récipient à liquide qui comprend une remplisseuse structurelle et une paroi externe du récipient, couplée adéquatement à la remplisseuse structurelle. Ces modes de réalisation ont en outre trait à un procédé de fabrication du récipient à liquide. Le procédé inclut le couplage adéquat d'une paroi de récipient externe à la remplisseuse structurelle.
Angstrom Power Inc.
Oyen Wiggs Green & Mutala Llp
LandOfFree
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