F - Mech Eng,Light,Heat,Weapons – 28 – F
Patent
F - Mech Eng,Light,Heat,Weapons
28
F
257/26
F28F 7/00 (2006.01)
Patent
CA 2007843
ABSTRACT The present invention is directed to an improved high performance heat exchanger for cooling electronic components, such as chips, by balancing thermal resistance, spatial temperature variations, pressure drop and space requirements. A fluid heat exchanger in accordance with the invention and adapted for cooling an electronic component comprises a housing having a base for receiving heat from the electronic component, a plurality of perpendicular, parallel, spaced fins each having a top, bottom, and two ends, with their bottoms connected to the base, and a fluid inlet tube communicating with the housing opposite the base and having a longitudinal axis perpendicular to the base and a fluid outlet in communication with the fins. The inlet tube axis is directed towards the fins between the ends of the fins for directing a cooling fluid from the inlet tube towards the fins and the base and towards the ends of the fins. The tops of the fins include a recess in communication with the inlet tube for supplying cooling fluid to all of the fins.
Gupta Omkarnath R.
Herrell Dennis J.
Nelson Richard D.
Borden Ladner Gervais Llp
Gupta Omkarnath R.
Herrell Dennis J.
Microelectronics And Computer Technology Corporation
Nelson Richard D.
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