Fluorinated resins with low dielectric constant

C - Chemistry – Metallurgy – 07 – C

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C07C 69/653 (2006.01) C07C 43/174 (2006.01) C08F 12/14 (2006.01) C08F 12/34 (2006.01) C08F 16/26 (2006.01) C08F 20/30 (2006.01) H01B 3/44 (2006.01) H05K 1/03 (2006.01)

Patent

CA 2131027

2131027 9317052 PCTABS00025 A highly fluorinated benzene compound is reacted with acryloyl chloride to yield a fluorinated liquid product which is used to impregnate a reinforcing structure. Upon impregnation, the liquid material is polymerized at about 55 ·C to produce a reinforced polymeric structure, which can be a circuit board. The polymer has dielectric constant of about 2.1, which is very low compared to the polymers used presently.

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