C - Chemistry – Metallurgy – 08 – J
Patent
C - Chemistry, Metallurgy
08
J
C08J 9/14 (2006.01) C08J 9/18 (2006.01) C08J 9/232 (2006.01)
Patent
CA 2236791
A foamed styrene resin material has a density .rho. of 0.02 to 0.008 and a melt tension of the styrene resin of 5 to 40 gf. The relation between an average cell diameter d (.rho.m) and the density .rho. is given by the expression: Image and a relation between a thermal conductivity .lambda. (kcal/m.cndot.h.cndot. °C) and the density .rho. given by the expression: Image Accordingly, the foamed styrene resin material has a low thermal conductivity and excellent insulating property in spite of a low density (high expansion ratio foam) thereof.
L'invention concerne un matériau de moussage en résine styrénique ayant une densité rho comprise entre 0.02 et 0.008 g/cm<3>, la tension de manière fondue de la résine styrénique étant comprise entre 5-40 gf. La relation entre le diamètre moyen d'une cellule <u>d</u>( mu m) et la densité rho est donnée par la formule (1). La relation entre la conductivité thermique lambda (kcal/m.h. DEG C) et la densité rho est donnée par la formule (2): lambda </= 0.0001 x 1/ rho + 0.023. En conséquence, le matériau à moussage en résine styrénique a une faible conductivité et une excellente propriété calorifuge malgré sa faible densité (due à un fort taux de foisonnement de la mousse).
Aramomi Yukio
Morioka Ikuo
Shimada Mutsuhiko
Riches Mckenzie & Herbert Llp
Sekisui Plastics Co. Ltd.
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