Folded package camera module and method of manufacture

Details Folded package camera module and method of manufacture Folded package camera module and method of manufacture

H - Electricity

04

N

H04N 5/369 (2011.01)

Patent

CA 2675179

An image-capture-device/processor package includes a flexible circuit substrate, an image capture device mounted on the flexible circuit substrate, a second device (e.g., processor) mounted on the flexible substrate, and a stiffener for at least partially supporting the second device. The ICD and the second device may be flip-chip mounted to the same surface of the flexible circuit substrate. The flexible circuit substrate may be folded so that the ICD is positioned back-to-back with the second device. The flexible circuit substrate may further include Land Grid Array (LGA) pads formed thereon to facilitate electrical connection with a host device.

L'invention concerne un boîtier constitué d'un dispositif de capture d'image (ICD) et d'un processeur, qui comprend: un substrat à circuit souple; un dispositif de capture d'image monté sur le substrat souple; un second dispositif (p. ex. un processeur) monté sur le substrat souple; et un renfort pour soutenir au moins partiellement le second dispositif. L'ICD et le second dispositif peuvent être des puces à protubérances montées sur la même surface du substrat à circuit souple. Le substrat à circuit souple peut être plié de sorte que l'ICD soit accolé dos à dos au second dispositif. Le substrat à circuit souple peut en outre comprendre des plots à grille matricielle à billes (LGA) formés sur le substrat pour faciliter le raccordement électrique avec un dispositif hôte.

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