Form-less electronic device and methods of manufacturing

H - Electricity – 01 – F

Patent

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H01F 27/02 (2006.01)

Patent

CA 2531599

Improved form-less electronic apparatus and methods for manufacturing the same. In one exemplary embodiment, the apparatus comprises a shape-core inductive device (200) having a bonded-wire coil (204) which is formed and maintained within the device (200) without resort to a bobbin or other form(er). The absence of the bobbin simplifies the manufacture of the device, reduces its cost and allows it to be made more compact (or alternatively additional functionality to be disposed therein). One variant utilizes a termination header (206) for mating to a PCB or other assembly, while another totally avoids the use of the header by directly mating to the PCB. Multi-core variants and methods of manufacturing are also disclosed.

L'invention concerne un appareil électronique amélioré dépourvu de gabarit d'enroulement et des procédés de fabrication de celui-ci. Dans une forme de réalisation exemplaire, l'appareil comprend un dispositif inductif à noyau façonné comportant une bobine de fil soudé qui est formé et maintenu dans le dispositif sans gabarit d'enroulement ou autre système de fixation. L'absence de gabarit d'enroulement permet de simplifier la fabrication du dispositif, de réduire son coût et de le rendre plus compact (ou d'y ajouter une fonction). Une variante utilise un adaptateur de terminaison s'assemblant à une carte à circuit imprimé ou à un autre ensemble ; une autre variante, qui permet d'éviter l'utilisation d'un adaptateur, s'assemble directement à la carte à circuit imprimé. Des variantes à noyaux multiples et des procédés de fabrication sont également décrits.

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