Formaldehyde-free autocatalytic electroless copper plating

Details Formaldehyde-free autocatalytic electroless copper plating Formaldehyde-free autocatalytic electroless copper plating

C - Chemistry, Metallurgy

23

C

6/4, 117/80

C23C 18/38 (2006.01) C23C 18/40 (2006.01) H05K 3/18 (2006.01)

Patent

CA 1255975

ABSTRACT FORMALDEHYDE-FREE AUTOCATALYTIC ELECTROLESS COPPER PLATING Copper may be deposited non-electrolytically from a composition comprising copper ions, a complexor to keep the copper ions in solution, and glyoxylate ions as a reducing agent. The use of formaldehyde is therefore avoided.

498113

Affiliated with

Also associated with

Rating

Formaldehyde-free autocatalytic electroless copper plating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Formaldehyde-free autocatalytic electroless copper plating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Formaldehyde-free autocatalytic electroless copper plating will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1189346