C - Chemistry – Metallurgy – 09 – D
Patent
C - Chemistry, Metallurgy
09
D
C09D 175/04 (2006.01) C04B 26/02 (2006.01) C04B 41/48 (2006.01) C09D 7/12 (2006.01) C09D 129/04 (2006.01) C09D 133/24 (2006.01) C09D 167/06 (2006.01) E04B 1/90 (2006.01) E04C 2/284 (2006.01)
Patent
CA 2434351
Disclosed are polymeric or polymerizable non-formaldehyde containing materials including a crosslinked grid and hydrophilic group chemically attached to the crosslinked grid. The composition further includes a compound having a modulus of elasticity of between about 40 GPa and about 250 GPa, such as mica The composition, applied as a back coating on to a panel provides a substantial degree of sag resistance under humid conditions.
Belmares Hector
Caldwell Kenneth G.
Armstrong World Industries Inc.
Gowling Lafleur Henderson Llp
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