Formation of superconducting devices using a selective...

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B44C 1/22 (2006.01) H01L 39/24 (2006.01)

Patent

CA 2279505

A method for forming a superconducting device (232) using a selective etching technique on superconducting thin films. The method utilizes rapid etching which combines ion implantation with chemical etching. The portions of the superconducting film to be retained are masked (215) from the ion implantation process (217). The chemical etching process then removes the implanted portions (225, 227) of the superconducting film at a much faster rate than the portions (223) not implanted so that only the un-implanted portions (223) remain. The resulting superconducting devices can be used, e.g., as nanostructures and nano tips, bolometers, multilayer RF coils, microwave waveguides and filters.

L'invention concerne un procédé permettant de former un dispositif supraconducteur (232), faisant appel à une technique d'attaque sélective mise en oeuvre sur des couches minces supraconductrices. Ledit procédé consiste à effectuer une attaque rapide qui combine une implantation d'ions et une attaque chimique. Les parties de la couche supraconductrice à conserver sont protégées (215) contre le processus d'implantation d'ions (217). Par attaque chimique on enlève ensuite les parties avec implantation d'ions (225, 227) de la couche supraconductrice à une vitesse bien plus grande que celle nécessaire pour enlever les parties sans implantation d'ions (223), de sorte que seules ces parties sans implantation d'ions (223) sont conservées. Les dispositifs supraconducteurs obtenus peuvent être utilisés, par exemple, comme nanostructures et nanopointes, bolomètres, bobines RF multicouches, guides et filtres à micro-ondes.

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