Forming die and managing method thereof

Details Forming die and managing method thereof Forming die and managing method thereof

B - Operations, Transporting

29

C

B29C 33/30 (2006.01)

Patent

CA 2254206

A forming die including of a holder having an upper portion and a lower portion, each portion having a main substrate extending in a first longitudinal direction. A fixing substrate is located on one end of the main substrate and a movable substrate is located on an opposite end of the main substrate and is movable along the main substrate in the first longitudinal direction. A plurality of die forming segments are situated between the movable substrate and the fixing substrate. Tie rods extend along the main substrate outside the periphery of the plurality of die forming segments, and connect the movable substrate and the fixing substrate to one another.

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