H - Electricity – 01 – L
Patent
H - Electricity
01
L
204/96.07
H01L 23/522 (2006.01) H01L 21/768 (2006.01)
Patent
CA 1079683
FORMING FEEDTHROUGH CONNECTIONS FOR MULTI-LEVEL INTERCONNECTION METALLURGY SYSTEMS ABSTRACT A method for forming feedthrough connections, or via studs, between levels of metallization atop semi- conductor substrates. A first level conductive pattern is formed atop the substrate. A feedthrough pattern is then formed atop the first conductive pattern, the feed- through pattern including one or more metal studs and a second, expendable material disposed on the studs. The formation of the feedthrough pattern is preferably ac- complished by a lift-off process. The expendable material is removable by an etchant which does not substantially attack either the metal or the substrate. An insulator is deposited atop the substrate and the pattern by RF sputtering at a bias which is sufficiently high to cause substantial reemission of the insulator, thereby covering the exposed substrate surfaces and the expendable material but leaving the side surfaces of the material exposed. The expendable material is then etched with said etchant, thereby removing the second material and the portion of the insulator dis- posed thereon. A second conductive pattern may then be formed atop the insulator and selectively connected to the feedthroughs which thereby provide the interconnection be- tween the first and second levels.
275384
Feng Bai-Cwo
Lechaton John S.
International Business Machines Corporation
Na
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