B - Operations – Transporting – 29 – C
Patent
B - Operations, Transporting
29
C
18/1196
B29C 33/02 (2006.01)
Patent
CA 1256261
ABSTRACT OF THE DISCLOSURE A mold apparatus comprises a mold main body pro- vided on its front surface with a mold surface of a predeter- mined shape and on its rear surface with a space for a jacket for receiving a thermal medium extending over almost the whole surface thereof, said mold main body being composed of a first platelike member at the front for forming the mold surface and a second platelike member at the rear, the two platelike members being juxtaposed and joined together in an air-tight manner at least at their circumference so that there is formed therebetween a space for the jacket, and a plurality of spacers distributed in said space and inter- connecting said platelike member.
493416
Ando Yoshio
Kinugasa Toshiyuki
Koshiro Akihiko
Odaka Kouichi
Honda Giken Kogyo Kabushiki Kaisha (also Trading As Honda Motor Ltd .)
Marks & Clerk
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