Formulation for the activation of substrate surfaces for...

Details Formulation for the activation of substrate surfaces for... Formulation for the activation of substrate surfaces for...

C - Chemistry, Metallurgy

23

C

C23C 18/30 (2006.01) C23C 18/28 (2006.01)

Patent

CA 2065605

Formulations containing an organometallic activator, a filler, a solvent and an aqueous dispersion of a polyure- thane polymer are outstandingly suitable for activation of surfaces of plastics for currentless metallisation thereof. The components of plastic activated in this way are preferably employed, after metallisation has been carried out, for shielding from electromagnetic waves.

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