Foundry resin components

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C - Chemistry, Metallurgy

08

G

400/111, 402/48,

C08G 8/36 (2006.01) B22C 1/22 (2006.01) C08G 8/04 (2006.01) C08G 18/54 (2006.01) C08K 5/29 (2006.01) C08L 61/14 (2006.01)

Patent

CA 1118143

ABSTRACT OP THE DISCLOSURE A new foundry binder composition comprises a selected phenol-formaldehyde resin, a polylsocyanate, and a selected solvent therefor. A preferred solvent is ketal or an acetal such as butyl acetal. The resole is essentially anhydrous, should contain about 8% free phenol, and is further preferably characterized by the presence of substituent -(CH2-O)n-R groups replaclng a phenolic hydrogen, R being a hydrocarbon radlcal such as butyl. Methylene and ether bridges linking phenolic nuclei are predominantly ortho-para with some para-para bridges. Also disclosed is the admixture of a reactive polyisocyanate and a solvent such as butyl acetal.

264840

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