Free flowing dry back-up insulating material

C - Chemistry – Metallurgy – 04 – B

Patent

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Details

C04B 35/14 (2006.01) C04B 35/01 (2006.01) C04B 35/10 (2006.01) C09K 3/00 (2006.01) F16L 59/00 (2006.01)

Patent

CA 2547674

Disclosed is a free flowing dry back-up material which comprises: - from 67 to 96% by weight of fly-ash; - from 2 to 15% by weight of a heat sensitive binder such as boric acid; - from 2 to 7% by weight of a non-wetting agent such as calcium fluoride; - from 0 to 10% by weight of a heat expandable material, viz. a material expandable as a function of the temperature such as vermiculite or graphite; and - from 0 to 1 % by weight of a dust suppressant such as kerosene. This material which is useful in particular in the aluminum industry has the advantages of being water free and free flowing, such avoiding the use of vibrator to position it into a shell. It also has a low density and a low thermal conductivity. Moreover, it is organic free as compared to the existing materials which use an organic binder to ensure a low temperature set; and it sets at a temperature lower than 400~F.

L'invention concerne un matériau de remplissage à écoulement facile comprenant entre 67 et 96 % en poids de cendres volantes; entre 2 et 15 % en poids de liant thermosensible, par exemple de l'acide borique; entre 2 et 7 % en poids d'un agent non mouillant, par exemple le fluorure de calcium; entre 0 et 10 % en poids d'un matériau thermodilatable, par exemple un matériau se dilatant en fonction de la température tel que la vermiculite ou le graphite; entre 0 et 1 % en poids d'un dépoussiérant, par exemple du kérosène. Ce matériau, utile en particulier dans l'industrie de l'aluminium, est intéressant en ce qu'il est anhydre et à écoulement facile, ce qui permet par exemple d'éviter l'emploi d'un vibrateur pour le positionner dans une coque. Il présente également une faible densité et une faible conductivité thermique. De plus, il est sans substance organique en comparaison des matériaux existants faisant appel à un liant organique garantissant un traitement à faible température; enfin, il durcit à une température inférieure à 400 ·F.

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