C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
117/45.1
C08K 9/04 (2006.01) C08K 9/10 (2006.01) C09C 3/00 (2006.01) C09C 3/04 (2006.01) C09C 3/10 (2006.01) C09D 5/03 (2006.01)
Patent
CA 2005978
K-17377/=/CGW 18 Free-flowing granular formulation Abstract of the Disclosure The invention relates to a free-flowing granular formulation which is obtained by charging to a fluidised bed a finely particulate inorganic or organic filler by itself or together with a solid component of a curable mixture or a part thereof, and then spray coating the particles with a curable mixture, the other components or the remaining portion of the curable mixture, as single component system, in the form of a liquid or suspension. The formulation so obtained is preferably used as moulding or coating powder, in particular for coating electrical or electronic components.
Fuhrmann Udo
Schwab Heinz
Ag Ciba-Geigy
Fetherstonhaugh & Co.
Fuhrmann Udo
Schwab Heinz
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