H - Electricity – 04 – B
Patent
H - Electricity
04
B
347/34
H04B 1/08 (2006.01) H05K 1/14 (2006.01) H05K 7/02 (2006.01)
Patent
CA 1205553
ABSTRACT OF THE DISCLOSURE A packaging arrangement for electronic apparatus, comprising: a support structure having first and second sides; a first circuit module having an upper edge and a lower edge and mechanically attached to the first side of said support structure; a second circuit module having an upper edge and a lower edge and mechanically attached to the second side of the support structure so that the first and second circuit modules are arranged substantially parallel to each other; a third circuit module removably situated adjacent the upper edges of the first and second circuit modules in a plane substantially normal to the first and second circuit modules; and electrical inter- connection means disposed adjacent the upper edges of the first and second circuit modules, for electrically coupling the first and second circuit modules to the third circuit module.
481113
Burbank Raymond W.
Gasparaitis Bernard V.
Krieg Larry M.
Schweet Richard R.
Williams William R.
Gowling Lafleur Henderson Llp
Motorola Inc.
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