Functional fluid additives for acid copper electroplating baths

Details Functional fluid additives for acid copper electroplating baths Functional fluid additives for acid copper electroplating baths

C - Chemistry, Metallurgy

25

D

C25D 3/38 (2006.01)

Patent

CA 2110214

A process and composition for high acid/low metal copper electroplating baths with improved leveling, adhesion, ductility and throwing power. The bath includes effective amounts of a functional fluid having at least one ether group derived from an alcohol epoxy or a bisphenol A and containing ethoxy and propoxy functionalities.

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