Functional package for complex electronic systems and method...

Details Functional package for complex electronic systems and method... Functional package for complex electronic systems and method...

H - Electricity

05

K

356/110

H05K 7/20 (2006.01) H01L 21/60 (2006.01) H01L 23/04 (2006.01) H01L 23/36 (2006.01) H01L 23/538 (2006.01) H05K 1/14 (2006.01)

Patent

CA 1037615

A FUNCTIONAL PACKAGE FOR COMPLEX ELECTRONIC SYSTEMS AND METHOD OF FABRICATION Abstract The package comprises a plurality of metal/polymer laminates whereby electronic components or functional units may be directly attached or plugged into laminated elements to form a unitary pack- age. An element or thermal transposer is included in the package to minimize thermal expansion mismatch between the components and the laminates and conduct thermal energy away from the attached electronic components. The polymer laminates are selected to have a configuration and thermal coefficient of expansion (TCE) that will permit the insertion and locking of materials within the laminates to form the unitary package. A wide variety of components and functional units having different electrical, thermal characteris- tics may be included in the package. The package is amenable to mass production processes that may be controlled by a designer to obtain packages at low cost, more flexibility and suitable for com- plex electronics system.

233998

Affiliated with

Also associated with

Rating

Functional package for complex electronic systems and method... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Functional package for complex electronic systems and method..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Functional package for complex electronic systems and method... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-958699