H - Electricity – 05 – K
Patent
H - Electricity
05
K
356/135, 356/141
H05K 1/00 (2006.01) H01L 21/48 (2006.01) H01L 21/60 (2006.01) H01L 23/48 (2006.01) H01L 23/495 (2006.01) H01L 23/50 (2006.01) H05K 3/00 (2006.01) H05K 3/12 (2006.01)
Patent
CA 1048657
ABSTRACT OF THE DISCLOSURE A gang bonding interconnect tape for use in an automatic bonding machine for gang bonding of semiconductive devices is fabricated by depositing a series of electrically insulative support structures, such as rings of epoxy resin, onto a metallic tape, as of copper, there being at least one of said electrically insulative support structures for individual ones of the interconnect lead patterns to be formed in said metallic tape. The side of the metallic tape, opposite to the support structure, is photoetched with a series of interconnect lead patterns with individual ones of said lead patterns being etched in registration with indivi- dual ones of said electrically insulative support structures. The individual electrically insulative support structure, preferably in the form of a ring, is located in each of the lead patterns intermediate the central region thereof and the outer region thereof for supporting the individual leads thereof in circumferentially spaced relation.
251273
LandOfFree
Gang bonding interconnect tape for semiconductive devices... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Gang bonding interconnect tape for semiconductive devices..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Gang bonding interconnect tape for semiconductive devices... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-306191