C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
C08K 3/00 (2006.01) B32B 27/08 (2006.01) B32B 27/18 (2006.01) B32B 27/32 (2006.01) C08K 7/00 (2006.01) C08L 101/00 (2006.01)
Patent
CA 2101037
ABSTRACT OF THE DISCLOSURE A gas barrier resin composition or its film having very high level gas barrier and moisture barrier properties, which comprises a resin and an inorganic laminar compound having a particle size of 5 µm and an aspect ratio of 50-5,000. Said resin composition or its film can be produced by dispersing an inorganic laminar compound in a resin or resin solution in the state that the inorganic laminar compound is swollen or cloven with a solvent, and removing the solvent from the dispersion, if necessary in the form of a film, while keeping said state .
Kawakita Toshio
Kotani Kozo
Kuroda Toshiya
Sakaya Taiichi
Marks & Clerk
Sumitomo Chemical Co. Ltd.
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