C - Chemistry – Metallurgy – 23 – C
Patent
C - Chemistry, Metallurgy
23
C
204/167
C23C 14/54 (2006.01) C23C 14/34 (2006.01)
Patent
CA 1219837
GAS DISTRIBUTION SYSTEM FOR SPUTTERING CATHODES Abstract Described is a gas distribution system for use with a sputtering cathode (11), mounted in a vacuum chamber (10) and having a substantially planar target (21) formed of the material to be sputtered onto substantially planar substrates (12) located therebeneath, characterized in that a distributor means is located at each side of said cathode for introducing two spearate gases into the vacuum chamber between the target and the substrates, said distributor means comprising a support member (49, 50) a pair of horizontal porous pipes (62, 65) located within said support member, and outlets (71, 74) in the support member through which the gases escape from the porous pipes into said vacuum chamber and by which the gases are directed in divergent directions, one toward the target and the other toward the substrates. Also described is a method of sputtering using the gas distribution system wherein the gas directed to the upper portion of the chamber (10) is an inert gas while the gas directed to the lower portion of the chamber is a reactive gas.
444584
Macrae & Co.
Shatterproof Glass Corporation
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