Gas encapsulated cooling module

Details Gas encapsulated cooling module Gas encapsulated cooling module

H - Electricity

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H01L 23/24 (2006.01) H01L 23/433 (2006.01) H01L 23/44 (2006.01) H01L 23/473 (2006.01)

Patent

CA 1097788

IMPROVED GAS ENCAPSULATED COOLING MODULE ABSTRACT of the Disclosure A gas encapsulated cooling module wherein at least one semiconductor chip to be cooled is supported on a substrate portion of the module the provision of a heat sink stud having a planar surface in thermal contact with a planar surface of the chip to be cooled, said stud being supported by a resilient thermally conductive bellow-like structure, whereby the planar surface of the stud is maintained in intimate thermal contact with the planar surface of the chip.

305890

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