Gas-permeable molding wire

B - Operations – Transporting – 27 – N

Patent

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Details

B27N 3/24 (2006.01) B27N 3/08 (2006.01) B28B 5/02 (2006.01) B31B 43/00 (2006.01)

Patent

CA 2064138

(57) ABSTRACT OF THE DISCLOSURE A gas-permeable wire (1) for board pressing in the manufacturing of cement-bonded board, fiberboard or chipboard or a similar product is disclosed. The invention is implemented by complementing the wire (1) with a raised patterning (2) that embosses the surface of the wire to be pressed. Figure 1

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