Gas pressure adjustable diebonding apparatus and method

H - Electricity – 01 – L

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H01L 21/58 (2006.01) H01L 21/603 (2006.01)

Patent

CA 2243438

A device placement or diebonding head (2) including a rod-and-piston combination including gas pressure applying inlet above (21) or below (17) the piston (4) and gas pressure opposing source, e.g., an independent gas pressure source or springs (20, 20a), to control vertical movement of the vacuum tool (6). Force exerted by the vacuum tool (6) on the device (8) being diebonded to substrate (9) is adjustable by adjusting the gas pressure on the piston (4) relative to the force of the pressure resisting source, e.g., springs (20, 20a). As the device (8) is bonded, a pressure sensure (29) may control a system to relieve the pressure exerted by the piston (4) on the device due to thermal expansion.

L'invention concerne une tête de mise en place d'éléments ou de fixation de puce (2), qui comprend un ensemble tige-et-piston ou une admission de gaz sous pression au-dessus (21) ou au-dessous (17) du piston (4), et une source opposée de pression de gaz, par exemple un système indépendant d'alimentation ou de ressorts à pression de gaz (20, 20a), afin de contrôler le mouvement vertical de l'instrument à dépression (6). La force qu'exerce cet instrument (6) sur l'élément (8) ou la puce à fixer sur le substrat (9) est modulable par réglage de la pression de gaz sur le piston (4) en fonction de la force correspondant à la source de pression opposée, c'est-à-dire correspondant à la force des ressorts (20, 22a). Lorsque l'élément (8) est fixé, un capteur de pression (29) peut intervenir dans le contrôle du système afin de diminuer la pression exercée par le piston (4) sur l'élément par effet d'expansion thermique.

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