Geometries and configurations for magnetron sputtering...

Details Geometries and configurations for magnetron sputtering... Geometries and configurations for magnetron sputtering...

C - Chemistry, Metallurgy

23

C

204/174, 204/96.

C23C 14/56 (2006.01) C23C 14/00 (2006.01) C23C 14/08 (2006.01) C23C 14/10 (2006.01) C23C 14/34 (2006.01) C23C 14/50 (2006.01) C23C 14/58 (2006.01) H01J 37/34 (2006.01)

Patent

CA 2029755

A thin film coating system incorporates separate, separately-controlled deposition and reaction zones for depositing materials such as refractory metals and forming oxides and other compounds and alloys of such materials. The associated process involves rotating or translating workpieces past the differentially pumped, atmospherically separated, sequentially or simultaneously operated deposition and reaction zones and is characterized by the ability to form a wide range of materials, by high throughput, and by controlled coating thickness, including both constant and selectively varied thickness profiles.

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