Glass to metal seal

Details Glass to metal seal Glass to metal seal

G - Physics

01

L

356/121, 49/81

G01L 9/04 (2006.01) G01L 9/00 (2006.01) H05K 13/04 (2006.01)

Patent

CA 1047169

ABSTRACT OF THE DISCLOSURE A pressure sensitive Silicon chip is indirectly bonded to a Stainless Steel housing of an electronic pressure transmitter through an intermediate holder assembly. This indirect bonding prevents thermal cracking of the Silicon chip due to the dif- ference in thermal expansion of the Stainless Steel housing and the Silicon chip. The holder assembly includes a Borosilicate glass tube having the Silicon chip bonded thereto which tube is soldered to a Nickel-Iron alloy holder by a eutectic alloy solder. In assembly, the Nickel-Iron holder is first brazed to the Stain- less Steel housing at a first temperature greater than the maximum non-destructive temperature of either the chip or the glass tube and the glass tube is then soldered to the Nickel-Iron holder at a lower temperature which will not destroy the chip or the tube holder.

273152

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