Glycidylester-anhydride adducts, curing of epoxy resin...

Details Glycidylester-anhydride adducts, curing of epoxy resin... Glycidylester-anhydride adducts, curing of epoxy resin...

C - Chemistry, Metallurgy

08

G

402/250, 260/361

C08G 59/18 (2006.01) C07D 307/89 (2006.01) C09D 163/00 (2006.01)

Patent

CA 2036686

T 1476 A B S T R A C T GLYCIDYLESTER-ANHYDRIDE ADDUCTS, CURING OF EPOXY RESIN POWDER COATINGS Novel curing agents for epoxy resins comprise oligomeric adducts of the glycidylester of pivalic acid and trimellitic anhydride having a melting point of from 80 to 110 °C. DO8/T1476FF

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