Gold alloy plating bath and process

C - Chemistry – Metallurgy – 25 – D

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C25D 3/56 (2006.01) C25D 3/62 (2006.01)

Patent

CA 1272160

ABSTRACT A citrate-free electroplating bath for the nigh speed deposition of gold alloy plates on substrates comprises a source of gold (for example gold (I) potassium cyanide), a source of alloying metal (for example, nickel sulfate), oxalic acid and formic acid. As citrate is not used, higher plating speeds are obtained and precipitates of certain citrate sales (for example, nickel citrate) are avoided.

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