C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/26
C25D 3/56 (2006.01) C25D 3/62 (2006.01)
Patent
CA 1272160
ABSTRACT A citrate-free electroplating bath for the nigh speed deposition of gold alloy plates on substrates comprises a source of gold (for example gold (I) potassium cyanide), a source of alloying metal (for example, nickel sulfate), oxalic acid and formic acid. As citrate is not used, higher plating speeds are obtained and precipitates of certain citrate sales (for example, nickel citrate) are avoided.
472996
Hendriks Jan J.m.
Lovie John R.
Somers Gerardus A.
Hendriks Jan J.m.
Lovie John R.
Omi International Corporation
Somers Gerardus A.
Swabey Ogilvy Renault
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