Gold compression bonding

Details Gold compression bonding Gold compression bonding

H - Electricity

01

L

356/173

H01L 21/60 (2006.01) H01L 21/603 (2006.01) H05K 3/32 (2006.01)

Patent

CA 1332639

ABSTRACT OF THE DISCLOSURE A method of attaching a flying lead to an integrated circuit chip having a bonding pad on a surface thereof has its application in creating flying leads that may be used to attach the integrated circuit chip directly to a circuit board. A gold ball is formed on an end of a gold lead by rapidly heating the end of the lead. The gold ball is pressed against the bonding pad of the integrated circuit chip so that the gold lead forms an electrical and mechanical bond to the bonding pad of the integrated circuit chip. The bonded gold lead is notched at a height above the gold ball and stretched so that it breaks at the notched position. The stretching straightens the bonded gold lead and forms a flying lead which is substantially perpendicular to the surface of the integrated circuit chip.

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