Gold electroplating bath and process

Details Gold electroplating bath and process Gold electroplating bath and process

C - Chemistry, Metallurgy

25

D

204/29

C25D 3/48 (2006.01)

Patent

CA 1180674

ABSTRACT OF THE DISCLOSURE Electrolytes for the electrodeposition of gold metal on substrates containing alkali metal or ammonium gold cyanides, a conducting agent, optionally a buffering agent, and at least 30 grams per liter of a grain refiner selected from the group consisting of oxalic acid, formic acid, and the alkali metal or ammonium salts thereof. The electroplating baths of the invention are operated at 2 pH of from 5 to 7.5, a temperature of 50° to 80°C., and a current density ranging from 1 to 20 ASF. The method of using the gold metal electroplating baths of this invention is also described and claimed.

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