C - Chemistry – Metallurgy – 25 – D
Patent
C - Chemistry, Metallurgy
25
D
204/29
C25D 3/48 (2006.01) C25D 3/62 (2006.01)
Patent
CA 1048964
ABSTRACT OF THE DISCLOSURE An aqueous gold plating solution for use in depositing bright gold plating is provided, which includes an alkali gold cyanide as the gold source, a metal chelate of an iminodiacetic acid, such as the indium or nickel chelate of iminodiacetic acid, which metal codeposits in small quantities with the gold, one or more conducting salts and a buffer, to maintain said solution at a pH within the range of from about 3 to about 4.5. The aqueous gold plating solution may optionally include a metal chelate of an aminopolycarboxylic acid, such as the nickel chelate of ethylenediamine tetraacetic acid. In addition, a method of electrodepositing gold on a substrate employing the gold plating solutions described above and gold-plated substrates or articles produced thereby are also provided. A synergistic chelate combination employed in the aforedescribed gold plating solutions to produce mirror bright gold finishes is also provided, which combination includes the nickel chelate of iminodiacetic acid, the nickel chelate of ethylenediamine- tetraacetic acid and the cobalt chelate of iminodiacetic acid.
215619
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