Graded composition primer layer

Details Graded composition primer layer Graded composition primer layer

C - Chemistry, Metallurgy

23

C

117/157, 204/96.

C23C 14/20 (2006.01) C23C 14/35 (2006.01) C23C 30/00 (2006.01) H05K 3/38 (2006.01)

Patent

CA 2001676

17 ABSTRACT Bonding between a metallic conductor and a substrate is improved by using a primer layer having a graded composition which continuously varies from a composition predominant in a metal which bonds well to the substrate at the substrate- primer layer interface to a composition predominant in the metal of the conductor at the conductor-primer layer interface. Specifically, the bonding characteristics of copper to polyimide substrate are improved by using a chromium-copper graded composition primer layer which is chromium-rich at the substrate-primer layer interface and copper-rich at the conductor-primer layer interface.

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