Grain boundary junctions in high temperature superconductor...

Details Grain boundary junctions in high temperature superconductor... Grain boundary junctions in high temperature superconductor...

H - Electricity

01

L

H01L 39/22 (2006.01) H01L 39/24 (2006.01)

Patent

CA 2106579

2106579 9216974 PCTABS00016 A novel method of producing weak-link grain boundary Josephson junctions in high temperature superconducting thin films is disclosed. These junctions are reliably and reproducibly formed on uniform planar substrates (10) by the action of a seed layer (40) placed intermediate the substrate (10) and the superconductor film (20). The superconductor film (22) grown atop the seed (42) is misoriented from the rest of the film (24) by an angle between 5· and 90·. The grain boundary (30) so formed acts as a high quality weak-link junction for superconductor devices. The performance of these junctions can be improved by the addition of buffer layers (50, 60) between the substrate (10) and the superconductor film (20).

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