C - Chemistry – Metallurgy – 08 – G
Patent
C - Chemistry, Metallurgy
08
G
C08G 73/10 (2006.01) C08J 3/09 (2006.01) C08J 3/12 (2006.01) C08J 3/14 (2006.01) C08L 79/08 (2006.01) C09D 179/08 (2006.01)
Patent
CA 2077042
ABSTRACT OF THE DISCLOSURE This invention provides (1) a granular material of a polyimide precursor, which has excellent solubility in solvents and excellent moldability and from which a polyimide molding having excellent mechanical properties can be produced, (2) a mixture of a granular material of a polyimide precursor with a solvent, in which the polyimide precursor shows excellent storage stability and (3) a process for the production of a granular material of a polyimide precursor, in which a solvent can be easily removed. Particularly provided are a polyimide precursor granular material having an intrinsic viscosity of 0.7 or higher and a polyimide precursor mixture which consists of a polyimide precursor granular polyimide having an intrinsic viscosity of 0.7 or higher and a solvent that does not exhibit a strong mutual interaction with the polyimide precursor, as well as a process for the production of the polyimide precursor granular material. The granular material of a polyimide precursor can be obtained by allowing a tetracarboxylic dianhydride to undergo polymerization reaction with a diamine in a solvent that does not exhibit a strong mutual interaction with the polyimide precursor. - 31 -
Echigo Yoshiaki
Furukawa Mikio
Nakano Takeshi
Tomioka Isao
Riches Mckenzie & Herbert Llp
Unitika Ltd.
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