Grinding guide and method

Details Grinding guide and method Grinding guide and method

B - Operations, Transporting

24

B

51/12, 33/132, 5

B24B 49/10 (2006.01) B23Q 17/22 (2006.01) B24B 41/00 (2006.01) G01B 7/06 (2006.01) H05K 1/02 (2006.01) H05K 3/02 (2006.01) H05K 3/00 (2006.01) H05K 3/42 (2006.01)

Patent

CA 1300890

Applicants: Dawson et al. For: Improved Grinding Guide and Method ABSTRACT OF DISCLOSURE A guide for the grinding of a surface of an object having a region to be exposed, including at least two conductive leads and a conductive control track. Each conductive lead is associated with a different face of the object, and the control track interconnects the leads and extends across the surface to be ground which lies between the faces. At least a portion of the rear edge of the track is precisely located with respect to a predetermined grinding depth of the region so that a break in the track occurs with the grinding of the surface to that grinding depth.

555207

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