Grinding, lapping, and polishing compounds

Details Grinding, lapping, and polishing compounds Grinding, lapping, and polishing compounds

C - Chemistry, Metallurgy

09

K

57/12

C09K 3/14 (2006.01)

Patent

CA 1212845

GRINDING, LAPPING, AND POLISHING COMPOUNDS Abstract of the Disclosure Grinding, lapping, and polishing compounds containing an abrasive material, a thickener, and a water- soluble alkylene oxide polymer. In addition to good applications-related characteristic said compounds have the advantage of permitting the workpieces to be cleaned with water.

451144

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