Gripping arrangement for an apparatus for automatically...

Details Gripping arrangement for an apparatus for automatically... Gripping arrangement for an apparatus for automatically...

H - Electricity

05

K

356/22

H05K 3/00 (2006.01) B32B 37/22 (2006.01) G03F 7/16 (2006.01) H05K 13/00 (2006.01) B29C 31/00 (2006.01) B29C 31/08 (2006.01)

Patent

CA 1163726

GRIPPING ARRANGEMENT FOR AN APPARATUS FOR AUTOMATICALLY LAMINATING CIRCUIT BOARDS ABSTRACT OF THE INVENTION A gripping arrangement for removing laminated circuit boards from the lamination region of an automatic laminating apparatus includes a gripping element which grasps the board after a predetermined portion has emerged from the apparatus. A carriage is simultaneously actuated to impose a displacement force on the laminate to assist in withdrawing it from the apparatus.

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