Groove width trimming

Details Groove width trimming Groove width trimming

B - Operations, Transporting

44

C

B44C 1/22 (2006.01) F15C 5/00 (2006.01) H01L 21/302 (2006.01) H01L 21/306 (2006.01) H01L 49/02 (2006.01)

Patent

CA 2123004

2123004 9405516 PCTABS00030 A method for making a groove (205) of a precise width in a substrate (210). The groove may have any cross-sectional shape. The groove is formed by initially etching the substrate. The groove width (W) is then measured. The measured groove width is compared to the desired groove width (W2). Oxide is grown on the substrate in the region of the groove to adjust the width of the groove. The oxide may or may not be grown with the original etchant mask left on the substrate. Depending on whether it is desired to increase or decrease the groove width, the oxide is or is not removed. The process for increasing or decreasing groove width may be repeated any number of times as necessary to achieve a proper groove width. For many applications, the groove will be covered with a plate or other type of cap to define a channel as used in flow restrictors.

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