Ground clip apparatus for circuit boards

Details Ground clip apparatus for circuit boards Ground clip apparatus for circuit boards

H - Electricity

05

K

H05K 1/11 (2006.01) H01R 4/66 (2006.01) H01R 13/24 (2006.01) H05K 3/36 (2006.01) H05K 3/40 (2006.01) H05K 7/14 (2006.01) H05K 9/00 (2006.01) H05K 3/34 (2006.01) H01R 12/30 (2006.01)

Patent

CA 2313017

A ground clip apparatus is designed to make ground contact between two circuit boards (22, 24) as they are mated together. A standoff member (10) is mounted on one of the boards and a spring clip (12) member is mounted on the other board facing the standoff member. The spring clip member has spring arms (18) which are biased against the standoff member when the boards are mated together to make a reliable ground contact. At the same time, the standoff member resists deflection of either board towards the other board.

L'invention concerne une attache de mise à la terre conçue pour établir un contact de terre entre deux plaquettes de circuit (22, 24) appariées. On monte un élément droit (10) sur une des plaquettes et un élément d'attache à ressort (12) sur l'autre plaquette faisant face à l'élément droit. L'élément d'attache à ressort possède des bras à ressort (18) qui sont retenus par contrainte contre l'élément droit lorsque les plaquettes sont appariées, afin de former un contact de terre fiable. En même temps, l'élément droit empêche une déflexion d'une des plaquettes vers l'autre plaquette.

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