Halo-hydrocarbon polymer coating

H - Electricity – 05 – K

Patent

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Details

H05K 3/28 (2006.01) C12Q 1/00 (2006.01) H01H 13/70 (2006.01) H01L 23/485 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2733765

In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multilayer coating.

Dans certains modes de réalisation, une carte de circuit imprimé comporte un substrat composé d'un matériau isolant. La carte de circuit imprimé comporte en outre une pluralité de pistes conductrices reliées à une surface au moins du substrat. La carte de circuit imprimé comporte en outre un revêtement multicouche déposé sur une surface au moins du substrat. Le revêtement multicouche (i) couvre une partie au moins de la pluralité de pistes conductrices et (ii) comporte au moins une couche formée d'un polymère d'hydrocarbure halogéné. La carte de circuit imprimé comporte en outre au moins un composant électrique raccordé par brasage à au moins une piste conductrice, la brasure étant réalisée à travers le revêtement multicouche de telle sorte que le joint brasé assure la continuité du revêtement multicouche.

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