Halogenated epoxy resins and advanced resins prepared therefrom

C - Chemistry – Metallurgy – 08 – G

Patent

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402/260, 400/590

C08G 59/06 (2006.01) C07C 37/62 (2006.01) C07D 303/24 (2006.01) C08G 59/30 (2006.01) C08G 59/32 (2006.01) H05K 1/03 (2006.01)

Patent

CA 1323462

ABSTRACT The present invention is directed to halogenated aromatic epoxy resins wherein the halogen atoms are in the meta position with respect to a glycidyl ether group attached to an aromatic ring and to advanced epoxy resins prepared from the halogenated aromatic epoxy resins. The advanced epoxy resins result from the reaction of a relatively low molecular weight epoxy resin and a polyhydric phenol wherein at least one of the reactants contains at least one halogen atom which is meta with respect to a glycidyl ether group or a hydroxyl group attached to an aromatic ring. These advanced epoxy resins are particularly useful in circuit boards or other electrical laminate applications, potting and encapsulation applications and other applications where flame retardant properties are desired. When cured with a suitable ouring agent, the advanced epoxy resins of the present invention possess an improvement as compared to an advanced epoxy resin containing halogen atoms which are ortho with respect to 34,398-F a glycidyl ether group in at least one of thermal stability, glass transition temperature, relationship of viscosity to molecular weight and resistance to forming hydrolyzed halides in the presence of a refluxing solution of an alkali metal hydroxide. 34,398-F

546396

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