C - Chemistry – Metallurgy – 08 – L
Patent
C - Chemistry, Metallurgy
08
L
96/152
C08L 101/04 (2006.01) C08K 5/00 (2006.01) C09J 4/06 (2006.01) C09J 167/00 (2006.01) G03F 7/032 (2006.01)
Patent
CA 1065667
ABSTRACT OF THE DISCLOSURE: Halogenated photopolymerizable adhesive, which comprises: a) 20 to 70% by weight of at least one halogenated polymer, which: (1) has a chain interrupted by at least one oxygen or nitrogen atom, (2) contains from 4 to 70% by weight of halogen atoms attached to carbon atoms having the electronic configuration sp2, (called "active halogen atoms"), (3) has an average molecular weight between 700 and 10,000 and (4) has a glass transition temperature (Tg) between -80°C and 20°C; b) 5 to 30% by weight of at least one organic monomer compound containing at least two acrylic or methacrylic acid radicals and containing from 0 to 65% by weight of active halogen atoms; c) 20 to 70% by weight of at least one organic monomer compound containing an acrylic or methacrylic acid radical and containing from 0 to about 65% by weight of active halogen atoms; d) about 1 to about 25% by weight of a photo-initiator system comprising: 1) 0.5 to 100% by weight of at least one aromatic ketone, 2) 0 to 99.5% by weight of at least one tertiary amine, at least one carbon atom of which, in the alpha position with regard to the nitrogen atom, carries at least one hydrogen atom, 3) 0 to 90% by weight of an aromatic or non-aromatic alpha-dione, the sum of 1) +2) +3) representing 100% by weight of the photo- initiator system, the total content of active halogen atoms amounting to 3 to 50% by weight of the total halogenated photo- polymerizable adhesive and lamination or contact adhesives based on said halogenated photopolymerizable adhesive.
252153
Colpaert Marc
de Poortere Michel
Dufour Paul
Vrancken August
Na
Ucb S.a.
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