Hardenable resin composition

Details Hardenable resin composition Hardenable resin composition

C - Chemistry, Metallurgy

08

L

6/180, 400/1821

C08L 93/04 (2006.01) G03F 7/027 (2006.01) G03F 7/032 (2006.01) H05K 3/00 (2006.01)

Patent

CA 2002906

HARDEN ABLE RESIN COMPOSITION Abstract of the Disclosure A resin composition hardenable by irradiation of a high energy ray is disclosed, which includes: (a) a resin selected from the group consisting of rosins and modified rosins and having an acid value of at least 150 and a Gardner color scale of not greater than 15; (b) a compound of the general formula (I) Y - CO - O ( A - O ) CO - CR = CH2 (I) wherein Y represents Image or Image , A represents an alkylene having 1-4 carbon atoms, R represents hydrogen or methyl and m is an integer of 1-4; (c) a hydroxyl group-containing compound having only one acrylic or methacrylic group and at least one hydroxyl group; and (d) a polyol compound having at least two hydroxyl groups. The resin composition is useful for plugging through-holes of a metal plated board in manufacturing printed wiring boards.

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