C - Chemistry – Metallurgy – 22 – C
Patent
C - Chemistry, Metallurgy
22
C
C22C 21/06 (2006.01) H05K 1/02 (2006.01) H05K 3/00 (2006.01) B21B 1/38 (2006.01)
Patent
CA 2330162
A hardened aluminum alloy, for use in the manufacture of printed circuit boards, having elevated levels of manganese and magnesium and produced as a sheet by a cold rolling process to a specified thickness.
Copper To Copper North America Llc
Macrae & Co.
LandOfFree
Hardened aluminum alloy for use in the manufacture of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Hardened aluminum alloy for use in the manufacture of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hardened aluminum alloy for use in the manufacture of... will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1633409