C - Chemistry – Metallurgy – 08 – K
Patent
C - Chemistry, Metallurgy
08
K
400/106, 402/273
C08K 5/31 (2006.01)
Patent
CA 1229698
ABSTRACT Hardener solution for epoxy resin masses The present invention provides a hardener solution for epoxy resin masses, based on dicyandiamide, wherein it contains a) 50 to 90 parts by weight of dimethylformamide, b) 5 to 50 parts by weight of a low boiling ketone and/or alcohol and c) 5 to 32 parts by weight of dicyandiamide, referred to 100 parts by weight of the sum of components a) and b).
467793
Marcoux & Sher Swabey Mitchell Houle
Skw Trostberg Aktiengesellschaft
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