Hardener solution for epoxy resin masses

C - Chemistry – Metallurgy – 08 – K

Patent

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400/106, 402/273

C08K 5/31 (2006.01)

Patent

CA 1229698

ABSTRACT Hardener solution for epoxy resin masses The present invention provides a hardener solution for epoxy resin masses, based on dicyandiamide, wherein it contains a) 50 to 90 parts by weight of dimethylformamide, b) 5 to 50 parts by weight of a low boiling ketone and/or alcohol and c) 5 to 32 parts by weight of dicyandiamide, referred to 100 parts by weight of the sum of components a) and b).

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