Header assembly for mounting to a circuit substrate

Details Header assembly for mounting to a circuit substrate Header assembly for mounting to a circuit substrate

H - Electricity

01

R

H01R 13/648 (2006.01) H01R 12/16 (2006.01) H01R 33/94 (2006.01)

Patent

CA 2306033

A header assembly is mounted to a backplane and receives a complementary electrical connector. The header assembly has an insulating shroud having a base with backplane and connector sides and a primary edge, and differential signal pin pairs, ground shields, and ground pins mounted to the base. The signal pin pairs are arranged into rows extending in a first direction along the base and along the base primary edge, and columns extending in a perpendicular second direction along the base. The signal pins in each pair are adjacently arranged into a sub-row extending in the first direction. Each signal pin in a pair has an inner side facing the other pin in the pair, an opposing outer side, and primary and non-primary sides facing toward and away from the base primary edge, respectively. One ground shield is associated with each signal pin. Each ground shield extends through the base between the connector side and the backplane side, and includes first and second attached wings arranged at right angles. The first wing extends along the first direction adjacent and along either the primary or non- primary side of the associated signal pin, and the second wing extends along the second direction adjacent and along the outer side of the associated signal pin. The ground shields in combination substantially electromagnetically isolate within the base each signal pin pair from all others. Each ground pin electrically contacts at least one ground shield at the second wing thereof.

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